Obstacles to Systemic Innovation An Illustration From Semiconductor Manufactur
Obstacles to Systemic Innovation An Illustration From Semiconductor Manufactur
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The adaptation of the SMIF-Arms is rather simple, due to a good design. The contamination tests give good results, especially in a Class 10, 000 room when using laminar flow boxes to load and unload the SMIF-Pods. The ease of use is good, operators like to work with SMIF" (Koolen, 1990).
LSI Logic ran a five-month study of microenvironment technology on a six- inch wafer processing line in a Class 10 cleanroom (Crouzet-Pascal, 1990). The experiment includes wafer lots for six different customer...s. The analysis consists of measurements of yield improvement (die per wafer and yield distribution), tool reliability, and production logistics. The process tools include photolithography (coat/bake, align, develop, and develop inspection) and etch (dry metal etch, dry stripping, and etch/final inspections). ' Table 10 shows the results of the experiment. The data on yield improvement are mixed: in one case the SMIF yield is significantly below the yield realized on the conventional processing line, in another case there is virtually no difference, and four in four cases there are significant yield increases which range from 6% to 15% with an average number of die per wafer.
What to read after Obstacles to Systemic Innovation An Illustration From Semiconductor Manufactur?
You can find similar books in the "Read Also" column, or choose other free books by Michael a Rappa to read onlineMoreLess
To quickly assess the difficulty of the text, read a short excerpt:
The adaptation of the SMIF-Arms is rather simple, due to a good design. The contamination tests give good results, especially in a Class 10, 000 room when using laminar flow boxes to load and unload the SMIF-Pods. The ease of use is good, operators like to work with SMIF" (Koolen, 1990).
LSI Logic ran a five-month study of microenvironment technology on a six- inch wafer processing line in a Class 10 cleanroom (Crouzet-Pascal, 1990). The experiment includes wafer lots for six different customer...s. The analysis consists of measurements of yield improvement (die per wafer and yield distribution), tool reliability, and production logistics. The process tools include photolithography (coat/bake, align, develop, and develop inspection) and etch (dry metal etch, dry stripping, and etch/final inspections). ' Table 10 shows the results of the experiment. The data on yield improvement are mixed: in one case the SMIF yield is significantly below the yield realized on the conventional processing line, in another case there is virtually no difference, and four in four cases there are significant yield increases which range from 6% to 15% with an average number of die per wafer.
What to read after Obstacles to Systemic Innovation An Illustration From Semiconductor Manufactur?
You can find similar books in the "Read Also" column, or choose other free books by Michael a Rappa to read onlineMoreLess
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